HDI PCB Manufacturer — High-Density Interconnect Boards with Blind & Buried Vias
As devices get smaller and pin counts keep rising, standard through-hole multilayer boards run out of routing space. HDI (High-Density Interconnect) technology solves this with laser-drilled microvias, blind and buried vias, and finer lines and spaces — packing more connections into fewer layers and a smaller footprint.
FX PCB Co., Ltd. manufactures HDI printed circuit boards in Shenzhen, China, and assembles them in-house. We have produced PCB and PCBA since 2010 under ISO 9001 quality management, working to IPC-A-600 and IPC-A-610 standards. Send us your Gerber files and stack-up, and our engineers will review the design for manufacturability and quote within 24 hours.
What We Build
- HDI structures with blind and buried vias — connections only occupy the layers they need, freeing routing space on every other layer
- Microvia technology for fine-pitch BGA breakout and high component density
- Multilayer builds from 1 to 32 layers (rigid), combining HDI outer layers with conventional cores
- Controlled impedance for high-speed signals, ±10% tolerance
- Surface finishes: ENIG, HASL, immersion silver and OSP — ENIG recommended for fine-pitch HDI designs
- Bare boards or fully assembled — HDI PCB fabrication and PCBA under one roof, so via quality and assembly yield are controlled by one team
For related services, see our multilayer PCB range and turnkey PCB assembly.
Testing on Every Order
HDI boards fail invisibly when a microvia is defective, so testing is not optional. Every FX PCB order goes through the inspection flow described on our PCB testing page: AOI inspection, X-ray inspection for hidden via and BGA joints, impedance testing, and electrical / functional testing before shipment.
Typical Applications
- Telecommunications and networking equipment
- Medical devices
- Consumer electronics — smartphones, wearables, tablets and compact IoT devices
- Industrial control systems
How It Works
- Send your Gerber files, stack-up requirements and (for assembly) your BOM
- Free DFM review — we flag via, annular ring and impedance issues before production
- Quotation within 24 hours
- Prototype run, then volume production with the same process controls
FAQ
What is the difference between HDI and a standard multilayer PCB?
A standard multilayer PCB uses mechanically drilled through-holes that pass through every layer. An HDI board adds laser-drilled microvias plus blind and buried vias, so connections only occupy the layers they need. The result is higher routing density, smaller board size, and shorter signal paths.
Can you assemble the HDI boards you fabricate?
Yes. PCB fabrication and PCBA assembly are both core FX PCB services. We handle fine-pitch BGA placement, SMT and through-hole assembly, and ICT / functional testing, so you receive tested boards, not just bare PCBs.
What files do you need for a quote?
Gerber files (RS-274X), your layer stack-up and impedance requirements, and a BOM if you want assembly included. We reply with a quotation within 24 hours.
Do you offer prototypes before volume production?
Yes — we support everything from rapid prototyping to high-volume production, and we recommend a prototype run for first-time HDI designs so the stack-up is validated before scaling.
Get a Quote
Send your Gerber files to [email protected] or use our quote form — an engineer-reviewed quotation within 24 hours.