PCBA Manufacturer in China

FX PCB Co., Ltd. provides turnkey PCB assembly from our own SMT plant — PCB fabrication, component sourcing, SMT & DIP assembly, testing and final assembly under one roof. From 5-piece prototypes to volume production.

MOQ from 5 pcs · 11 Yamaha placement machines · 6M–7M placements per day · ISO 9001 · ISO 13485 · IATF 16949

SMT Capability

ItemCapability
PCB Size50 × 50 mm to 810 × 490 mm
PCB Thickness0.75 – 4.0 mm
Board TypesRigid PCB, FPC, Rigid-Flex PCB
Smallest Component01005 (imperial)
Min. Component Gap0.25 mm (QFP / QFN / BGA)
Max. Component Height15 mm
Printing Accuracy±0.015 mm
Placement Accuracy±0.035 mm
Daily Capacity6,000,000 – 7,000,000 placements

Equipment highlights: 11 Yamaha high-speed placement machines (YSM20R ×5, YSM10 ×6), 6 automatic solder paste printers, 3 SPI systems, dual-track in-line AOI, X-ray inspection for BGA, wave soldering with an 8 m DIP line, BGA rework station, laser marking and full assembly lines.

SMT production lines at FX PCB's PCB assembly plant

Turnkey Assembly Process

  1. DFM review of Gerber & BOM
  2. PCB fabrication in-house
  3. Component sourcing with full traceability
  4. Solder paste printing + SPI
  5. SMT placement + reflow
  6. AOI & X-ray inspection
  7. DIP / wave soldering & hand assembly
  8. Testing, final assembly & packing

Learn more about our turnkey PCB assembly services.

Component Sourcing & Traceability

Every component is sourced through authorized channels and verified at incoming inspection (LCR measurement, marking and date-code checks). Lot and date codes are recorded against your order, so every board we ship can be traced back to its component batches. First-article inspection confirms the first board against your BOM before the run continues, and X-ray inspection verifies BGA and QFN soldering that AOI cannot see. If a part is obsolete or long-lead, our engineers propose verified equivalents for your approval — we never substitute a component without your written confirmation.

Testing & Quality

  • SPI (3D solder paste inspection) ×3
  • In-line dual-track AOI + off-line AOI
  • X-ray inspection for BGA assemblies, plus X-ray component counting
  • First-article tester on every new job
  • IQC incoming inspection with digital bridges; oscilloscopes and spectral analysis for LED products
  • BGA rework station; dry-ice cleaning for finished boards
AOI optical inspection of assembled circuit boards

Industries We Serve

Industrial control · Power supplies · LED lighting · Consumer electronics · Automotive electronics (IATF 16949:2016 certified production) · Medical devices (ISO 13485:2016 certified PCBA manufacturing)

See also: Ceramic PCB Manufacturer · Turnkey PCB Assembly

Production Terms

ItemTerms
Minimum order5 pcs
Prototype lead time2 weeks
Mass production lead time3–10 weeks, depending on component lead times
Assembly typesSMT, DIP / wave soldering, mixed assembly, final product assembly (screw fastening, laser marking, cleaning)
DIP insertion line and product assembly line

Certifications

ISO 9001:2015 — FX PCB Co., Ltd. · ISO 13485:2016 — medical device PCBA manufacturing · IATF 16949:2016 — automotive PCB & PCBA manufacturing

ISO 9001:2015 certificateISO 13485:2016 certificateIATF 16949:2016 certificate

Why FX PCB

  • One partner for bare PCB + PCBA: fabrication and assembly in our own facilities, no hand-offs between vendors
  • Engineering review before production: DFM feedback on every order
  • Traceable sourcing: no grey-market components, no unapproved substitutions
  • Low entry point: prototypes from 5 pcs, the same lines run your volume orders

Frequently Asked Questions

What is your minimum order quantity for PCBA?
5 pcs, for both prototypes and production orders.
Prototypes typically 2 weeks; mass production 3–10 weeks depending on component lead times.
Yes. Turnkey: we fabricate the PCB and source all components. Consigned / partial-consigned: you supply key parts, we handle the rest.
Authorized-channel sourcing only, incoming inspection with LCR and marking checks, lot/date-code records per order, and no substitutions without your written approval.
SPI, AOI and X-ray (for BGA/QFN) inspection are standard on SMT orders; first-article inspection is performed on every new job.
Yes: components down to 01005, QFP/QFN/BGA with 0.25 mm minimum gap, verified by X-ray.
Yes: DIP, final assembly, screw fastening, laser marking and cleaning are done on our own assembly lines.
Gerber files, BOM with manufacturer part numbers, and pick-and-place (centroid) data. Assembly drawings and test requirements help us quote more accurately.

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